We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Plasma Cleaning Equipment.
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Plasma Cleaning Equipment Product List and Ranking from 4 Manufacturers, Suppliers and Companies

Plasma Cleaning Equipment Product List

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Contributing to extensive batch processing! Plasma cleaning equipment

"Advanced Visible Plasma" is recommended for processing three-dimensional objects and thick workpieces, such as 3D glass and PCBs.

"Advanced Visible Plasma" is a plasma cleaning device characterized by its compact head. It also features visualization, long-distance irradiation (up to 15mm), and low temperature, making it suitable for situations where a wide area needs to be processed at once. It can be used in applications such as module processes for electronic components, packaging processes for semiconductors, and bonding, coating, and cleaning of secondary batteries. 【Features】 ■ Compact head ■ Visualization ■ Long-distance irradiation (up to 15mm) ■ Low temperature *For more details, please refer to the PDF document or feel free to contact us.

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  • Plasma surface treatment equipment

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Mass production plasma cleaning device (large plasma cleaner)

Supports automated mass production lines. Inline type, sheet type, and various types with flexible hardware configurations, all with a proven track record of high effectiveness of vacuum plasma in mass production lines.

Expanding a chamber configuration with a proven track record in advanced thin film devices for cleaning applications. Achieving high cleaning effectiveness across various substrates. Flexible hardware configuration and high process capability tailored to the substrate and production volume. Supporting cleaning, descumming, ashing, hydrophilic treatment, hydrophobic film treatment, and various other applications. A large plasma device with extensive experience from substrate mounting to material surface treatment.

  • Plasma surface treatment equipment
  • Etching Equipment
  • Ashing device

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Custom product for customer specifications - Plasma cleaning device

This product is an example of a customized product tailored to your specifications. We will customize it according to your intended use.

This product is a parallel plate type plasma treatment device. It allows switching between two plasma modes, DP (Direct Plasma) mode and RIE (Reactive Ion Etching) mode, using only the controls on the panel. It can be used for various process applications, such as improving adhesion and sealing in die attach during assembly processes like BGA.

  • Testing Equipment and Devices

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Plasma cleaning device "POEM" (plasma cleaner)

Multi-functional plasma cleaning device. Sample testing currently accepted. Suitable for cleaning and hydrophilization, improving solder wettability, and optimal for pre-treatment before mounting.

Simplifying and reducing the cost of semiconductor manufacturing equipment chambers for application in plasma cleaning. Achieving unprecedented surface treatment through plasma mode switching mechanisms (RIE, DP) and multi-gas (Ar, N2, O2, H2) processes. Substrate cleaning (removal of oxides, organic materials, and fine foreign substances). Hydrophilic treatment (pre-treatment for plating, improving solder wettability). Hydrophobic treatment (pre-treatment before wet processes). Proven results in reflow pre-treatment with significant improvements in solder wettability. Extensive track record in mass production lines for high-end products (high-density mounting substrates, flexible substrates, power device modules). Inline and sheet-type options are available in the standard lineup to match substrate and line configurations.

  • Other mounting machines

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DLC De-coating Device (Plasma Cleaner for Precision Molds)

A plasma cleaning device with extensive experience in removing DLC films from aspherical lenses. An essential dry film removal device for the repair of high-value-added molds.

Upgraded and customized the highly experienced plasma cleaning device "POEM" for DLC film removal. Improved the energy of ions during processing compared to conventional types, enabling the removal of dense DLC films. Proven results not only in the standard O2 cleaning process but also in the multi-gas process for the removal of various customized DLC films, including Si-containing DLC. Naturally, it also supports the removal of molding residues and oxidation layers on mold surfaces, as well as cleaning before plating. Provides proven processes for cleaning and surface treatment before and after mold specifications.

  • Etching Equipment
  • Ashing device
  • Plasma surface treatment equipment

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Hydrogen Plasma Cleaning Device (Ion Cleaning Type)

H2 (Surface cleaning of various substrates using the reducing power of hydrogen plasma. Improved hydrophilicity and wettability due to the removal of surface oxide layers. A new surface cleaning technology using dry, room temperature treatment.)

A new type of multi-purpose plasma cleaning device with a proven track record has arrived. In addition to the conventional surface cleaning function using plasma, it now features a reduction cleaning function using hydrogen plasma. The ability to remove surface oxide layers has significantly improved, and the hydrophilicity of substrates after cleaning has greatly increased. It also supports conventional plasma cleaning as before. Furthermore, with new cleaning functions such as combined cleaning with traditional Ar plasma cleaning and two-step cleaning with O2 (oxygen) cleaning, the cleaning targets and effectiveness have been greatly enhanced compared to general plasma cleaning. This new plasma cleaning device can accommodate everything from small-scale to full-scale production lines.

  • Ashing device
  • Plasma surface treatment equipment
  • Other surface treatment equipment

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Plasma cleaner device "SPE-2136A"

Simultaneous processing of two wafers for high throughput. Contributes to reducing wafer transfer costs.

The SPE-2136A is a plasma cleaner device capable of residue removal, surface modification, and ashing treatment for wafers ranging from φ4 to φ6 inches. It comes with an automatic transport mechanism, which helps prevent wafer breakage and reduces labor costs and working time associated with wafer transfer. The process chamber can handle two wafers simultaneously, achieving high throughput. 【Features】 ■ Compact design measuring 1400(W) × 3000(D) × 1900(H) mm ■ Distribution within the wafer is ±5% or less ■ Compatible with ultra-thin piezoelectric wafers such as SAW devices ■ Ar plasma cleaning is also available as an option *For more details, please refer to the documentation. Feel free to contact us with any inquiries.

  • Plasma surface treatment equipment
  • others

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